Brand: SUSS MicroTec | Category: Nanotechnology

A semi-automated mask aligner and imprint tool for wafers up to 300 mm. It combines full field UV exposure with SMILE imprint technology and a levelling system that measures the exposure gap in real time, covering MEMS, advanced packaging and research work.
| Parameter | Value |
|---|---|
| Substrate sizes | wafers up to 300 mm |
| Imprint | SMILE technology for standard to high-end imprint processes |
| Illumination | MO Exposure Optics with telecentric exposure |
| Levelling | real-time gap measurement for substrate parallelism |
| Light source | LED |
| Warped wafer support | vacuum chucks and proximity exposure modes |
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Contact Vvon Technologies Limited about SUSS MicroTec equipment requirements in Bangladesh.
Phone: +8801805987890 | Email: info@vvon.com.bd
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