Spark Plasma Sintering Furnace Type HHP D hybrid
Brand: FCT Systeme | Category: Nanotechnology
A hybrid heated FAST/SPS system that combines direct pulsed current heating with one or more external heating systems acting on the press tool. The added external heat balances thermal gradients in large parts and in materials with poor thermal conductivity.
Technical Specifications
| Parameter | Value |
|---|---|
| Operating temperature | up to 2200 deg C |
| Specification | Models H-HP D 10 to H-HP D 400, component diameter 40 mm to 400 mm |
| Maximum pressing force | 100 kN to 4000 kN |
| Maximum hybrid heating power | 60 kW to 700 kW |
| Vacuum | 5x10-2 mbar(a) |
| Specification | Heating rates up to 1000 K/min, up to 100 programmable segments per recipe |
Get a Quote
Request an itemised quotation covering the proposed configuration, availability, lead time and agreed supply and support scope.
Useful details to share
- Materials, sample dimensions and process or measurement goal
- Required performance and existing instrument interfaces
Share what you know. You can start with your name and a phone number or email; final specifications can follow.
Not sure which configuration you need? Help me choose
Contact Vvon Technologies Limited about FCT Systeme equipment requirements in Bangladesh.
Phone: +8801805987890 | Email: info@vvon.com.bd
More from Plasma Etching & Deposition
- nanoCVD-8G
A benchtop chemical vapour deposition system for graphene, carbon nanomaterials and advanced materials growth. It gives research groups local CVD process development without the footprint of a production derived CVD tool.
- Spark Plasma Sintering Furnace Type HP D
A directly heated spark plasma sintering system for the field assisted sintering technique. Pulsed direct current passes through the tool and the component, so cycle times fall to a few minutes and nanomaterials, graded materials and hardmetals can be densified at lower temperatures.
- nanoETCH
A compact plasma etching and surface modification system for low damage process development. It is used on 2D materials, graphene, silicon and oxide layers, and for substrate cleaning and surface activation before deposition.