XB8 Wafer Bonder
Brand: SUSS MicroTec | Category: Nanotechnology
A semi-automated wafer bonder with a closed process chamber for bond stacks up to 200 mm. Automatic loading with nitrogen purge, dual zone ceramic heating and three zone force control support anodic, fusion, eutectic, glass frit and metal diffusion bonding.
Technical Specifications
| Parameter | Value |
|---|---|
| Wafer size | up to 200 mm |
| Maximum bonding temperature | 500 °C |
| Temperature ramp | up to 30 K/min |
| Chamber pressure | 3000 mbar absolute down to 5x10-5 mbar |
| Pump down | 5x10-5 mbar reached in under five minutes |
| Force control | three zone precision bonding |
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Contact Vvon Technologies Limited about SUSS MicroTec equipment requirements in Bangladesh.
Phone: +8801805987890 | Email: info@vvon.com.bd
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