XBS300 W2W Hybrid Bonding Platform
Brand: SUSS MicroTec | Category: Nanotechnology
An automated hybrid bonding platform for wafer to wafer and collective die to wafer stacking on 200 mm and 300 mm wafers. Surface activation, metrology and bonding sit in one cluster for 3D stacked memory and 3D system on chip devices.
Technical Specifications
| Parameter | Value |
|---|---|
| Substrate sizes | 200 mm and 300 mm |
| Alignment accuracy | below 100 nm overlay |
| Thermal stability | ±25 mK over 12 hours with temperature control unit |
| Control | closed loop in X, Y and theta |
| Metrology | up to six modules in one cluster |
| Alignment technology | XBA with Inter Substrate Alignment |
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Contact Vvon Technologies Limited about SUSS MicroTec equipment requirements in Bangladesh.
Phone: +8801805987890 | Email: info@vvon.com.bd
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