XBC300 Gen2 SP Surface Preparation Cluster
Brand: SUSS MicroTec | Category: Nanotechnology
A surface preparation cluster for hybrid bonding that cleans and activates wafers without an integrated bonder, so it can feed stand-alone bonding tools. It combines aqueous cleaning, vacuum plasma activation and in-line infrared void metrology.
Technical Specifications
| Parameter | Value |
|---|---|
| Substrate sizes | 200 mm and 300 mm |
| Load ports | up to two automatic FOUP ports with cassette adapter options |
| Cassette stations | two tape frame stations |
| Handling | six axis robot |
| Void detection | resolution above 500 µm |
| Modules | aqueous cleaner, plasma activation chamber, in-situ infrared metrology |
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Contact Vvon Technologies Limited about SUSS MicroTec equipment requirements in Bangladesh.
Phone: +8801805987890 | Email: info@vvon.com.bd
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