XBC300 Gen2 D2W/W2W Hybrid Bonding Platform
Brand: SUSS MicroTec | Category: Nanotechnology
A hybrid bonding cluster that covers wafer to wafer, collective die to wafer and sequential die to wafer processes on one platform. Built with SET Corporation SA, it targets research and pilot lines that later scale into volume production.
Technical Specifications
| Parameter | Value |
|---|---|
| Substrate sizes | 200 mm to 300 mm |
| Wafer to wafer alignment | below 100 nm |
| Die to wafer alignment | ±100 nm |
| Die to wafer bond force | up to 300 N |
| Die spacing | down to 40 µm |
| Carriers | silicon and glass tape frame carriers |
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Contact Vvon Technologies Limited about SUSS MicroTec equipment requirements in Bangladesh.
Phone: +8801805987890 | Email: info@vvon.com.bd
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