XBS300 Temporary Bonding Platform
Brand: SUSS MicroTec | Category: Nanotechnology
A temporary bonder for 200 mm and 300 mm wafers built for volume manufacturing. Its modular frame accepts commercially available temporary bonding adhesives on silicon or glass carriers, and an on-board metrology module checks alignment during the run.
Technical Specifications
| Parameter | Value |
|---|---|
| Substrate sizes | 200 mm and 300 mm |
| Alignment accuracy | below 100 nm overlay with XBA Inter Substrate Alignment |
| Carriers | silicon and glass |
| Adhesives | all commercially available temporary bonding adhesives |
| Metrology | integrated module for real-time measurement |
Get a Quote
Request an itemised quotation covering the proposed configuration, availability, lead time and agreed supply and support scope.
Useful details to share
- Materials, sample dimensions and process or measurement goal
- Required performance and existing instrument interfaces
Share what you know. You can start with your name and a phone number or email; final specifications can follow.
Not sure which configuration you need? Help me choose
Contact Vvon Technologies Limited about SUSS MicroTec equipment requirements in Bangladesh.
Phone: +8801805987890 | Email: info@vvon.com.bd
More from Wafer Bonding
- XBC300 Gen2 Debonder and Cleaner
A modular debonding and cleaning cluster for tape mounted wafers and carriers at 200 mm, 300 mm and oversized formats. Mechanical peel-off and laser debonding modules can be combined with cleaning modules for thinned or full thickness wafers.
- DB12T Debonder
A mechanical peel-off debonder that separates support carriers from tape mounted wafers at room temperature. A dedicated roller controls the debond wave front, and force, speed and blade insertion height are all set electronically.
- SB8 Gen2 Wafer Bonder
A semi-automated universal wafer bonder for substrates up to 200 mm. It runs fusion, eutectic, diffusion, anodic and adhesive bonding under force and heat, and its sequential spacer removal withdraws each spacer separately before the wafers meet.