XBC300 Gen2 Debonder and Cleaner
Brand: SUSS MicroTec | Category: Nanotechnology
A modular debonding and cleaning cluster for tape mounted wafers and carriers at 200 mm, 300 mm and oversized formats. Mechanical peel-off and laser debonding modules can be combined with cleaning modules for thinned or full thickness wafers.
Technical Specifications
| Parameter | Value |
|---|---|
| Wafer sizes | 200 mm, 300 mm and oversized formats |
| Wafer thickness | down to 50 µm or below |
| Debond modules | DB300T mechanical peel-off and LD300 laser at 308 nm |
| Clean modules | AR300TF for thinned wafers and AR300 for full thickness |
| Carriers | glass, silicon and sapphire |
| Dispense modes | puddle, spray and high pressure |
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Contact Vvon Technologies Limited about SUSS MicroTec equipment requirements in Bangladesh.
Phone: +8801805987890 | Email: info@vvon.com.bd
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