DB12T Debonder
Brand: SUSS MicroTec | Category: Nanotechnology
A mechanical peel-off debonder that separates support carriers from tape mounted wafers at room temperature. A dedicated roller controls the debond wave front, and force, speed and blade insertion height are all set electronically.
Technical Specifications
| Parameter | Value |
|---|---|
| Substrate sizes | 4 inch to 12 inch wafers |
| Wafer thickness | as thin as 50 µm or below |
| Carrier materials | glass and silicon |
| Method | mechanical peel-off at room temperature |
| Controlled parameters | debonding force, speed and initiator blade insertion height |
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Contact Vvon Technologies Limited about SUSS MicroTec equipment requirements in Bangladesh.
Phone: +8801805987890 | Email: info@vvon.com.bd
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