XBC300 Gen2 D2W Wafer Bonder
Brand: SUSS MicroTec | Category: Nanotechnology
An automated sequential die to wafer hybrid bonder that places and bonds individual dies onto a target wafer. Surface activation, die placement and metrology are integrated in one frame for high bandwidth memory and other 3D integrated circuit stacks.
Technical Specifications
| Parameter | Value |
|---|---|
| Alignment accuracy | ±100 nm |
| Throughput | up to 1,000 dies per hour |
| Die size | 1 x 1 mm to 22 x 22 mm |
| Inter-die spacing | below 40 µm |
| Die thickness | down to 30 µm |
| Substrates | 200 mm and 300 mm wafers, 400 mm tape frames |
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Contact Vvon Technologies Limited about SUSS MicroTec equipment requirements in Bangladesh.
Phone: +8801805987890 | Email: info@vvon.com.bd
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