XBS200 Wafer Bonder
Brand: SUSS MicroTec | Category: Nanotechnology
A fixture-less automated permanent bonder for wafer sizes up to 200 mm, aimed at volume production of MEMS, LED and 3D advanced packaging. Dropping mechanical fixtures gives flexible handling and lets spacing and vacuum conditions be logged digitally.
Technical Specifications
| Parameter | Value |
|---|---|
| Wafer size | up to 200 mm |
| Bond force | 0.9 kN to 100 kN |
| Temperature range | 30 °C to 500 °C |
| Temperature ramp | up to 30 K/min |
| Temperature uniformity | ±1.5% |
| Alignment accuracy | below 100 nm with XBA Inter Substrate Alignment |
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Contact Vvon Technologies Limited about SUSS MicroTec equipment requirements in Bangladesh.
Phone: +8801805987890 | Email: info@vvon.com.bd
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