Brand: SUSS MicroTec | Category: Nanotechnology

An automated cluster coater and developer for wafers from 100 mm to 200 mm. Modular frames scale from research use up to high volume manufacturing, and the GYRSET closed cover method holds a solvent rich layer over the wafer for stable film thickness.
| Parameter | Value |
|---|---|
| Wafer sizes | 100 mm to 200 mm |
| Frame options | 3M, 5M and 6M |
| Input and output | 2 or 4 stations, or continuous run load port |
| Resist viscosity | below 100 cp to below 20,000 cp |
| Film thickness | below 100 nm to below 10 µm |
| Passivation layers | below 5 µm to below 250 µm |
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Contact Vvon Technologies Limited about SUSS MicroTec equipment requirements in Bangladesh.
Phone: +8801805987890 | Email: info@vvon.com.bd
A throughput enhanced version of the ACS200 Gen3 cluster coater and developer for wafers from 100 mm to 200 mm. Up to six spinner modules can be fitted, and special tooling handles warped, ultra-thin and stacked wafers used in advanced packaging.
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