Brand: SUSS MicroTec | Category: Nanotechnology

A fully automated cluster coater and developer for 200 mm and 300 mm wafers. Coating, baking and developing modules share one frame, so both wafer sizes run without mechanical changeover, from pilot lines through to high volume manufacturing.
| Parameter | Value |
|---|---|
| Wafer sizes | 200 mm and 300 mm processed without changeover |
| Resist viscosity | below 100 cp to below 20,000 cp |
| Film thickness | below 100 nm to below 250 µm |
| Coating | GYRSET closed cover coater technology |
| Metrology | TM300 module measures 1 to 100 µm interferometrically |
| Handling | ESD protected tooling for warped, ultra-thin and stacked wafers |
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Contact Vvon Technologies Limited about SUSS MicroTec equipment requirements in Bangladesh.
Phone: +8801805987890 | Email: info@vvon.com.bd
An automated cluster coater and developer for wafers from 100 mm to 200 mm. Modular frames scale from research use up to high volume manufacturing, and the GYRSET closed cover method holds a solvent rich layer over the wafer for stable film thickness.
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