Brand: Oxford Instruments | Category: Nanotechnology

Atomfab is a plasma enhanced atomic layer deposition system built for volume production of GaN power and RF devices. A remote plasma source designed for atomic scale processing gives low damage passivation and gate dielectric films, with clusterable automated wafer handling.
| Parameter | Value |
|---|---|
| Plasma ALD Al2O3 at 300 °C, within wafer thickness uniformity | <±1.0% |
| Plasma ALD Al2O3 at 300 °C, wafer to wafer thickness repeatability | <±1.0% |
| Plasma ALD Al2O3 at 300 °C, breakdown voltage | >=7.0 MV/cm |
| Plasma exposure time | 250 ms |
| Plasma strike time | 80 ms |
| Specification | Remote plasma ALD with controlled ion energy from near zero to 30 eV |
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Phone: +8801805987890 | Email: info@vvon.com.bd
PlasmaPro ASP is a remote plasma enhanced ALD system sharing the Atomfab platform. It deposits conformal oxides and nitrides across 200 mm wafers at high rate, using a low volume chamber for rapid gas exchange and a biased electrode for tuning film properties.
A benchtop thermal processing and annealing system for post deposition treatment. It is used for contact formation, crystallisation and interface work in photovoltaic, semiconductor and coatings research.
The PlasmaPro 100 ALE applies a cyclical, digital etch process for precise depth control on nanoscale layers. Built on the Cobra ICP platform, it removes material with low damage and smooth surfaces for GaN HEMT recess etching and 2D material patterning.