Brand: Oxford Instruments | Category: Nanotechnology

PlasmaPro ASP is a remote plasma enhanced ALD system sharing the Atomfab platform. It deposits conformal oxides and nitrides across 200 mm wafers at high rate, using a low volume chamber for rapid gas exchange and a biased electrode for tuning film properties.
| Parameter | Value |
|---|---|
| Precursor lines | maximum 6, any combination |
| Precursor size | 200 ml |
| Wafer electrode | 200 mm with bias, up to 400 °C deposition temperature |
| Heated inner chamber | 200 °C |
| Gas pod | 4 process plus 1 Ar onboard |
| Roughing pump | 600 m3/hr |
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The PlasmaPro 100 ALE applies a cyclical, digital etch process for precise depth control on nanoscale layers. Built on the Cobra ICP platform, it removes material with low damage and smooth surfaces for GaN HEMT recess etching and 2D material patterning.
Atomfab is a plasma enhanced atomic layer deposition system built for volume production of GaN power and RF devices. A remote plasma source designed for atomic scale processing gives low damage passivation and gate dielectric films, with clusterable automated wafer handling.
This configuration pairs the PlasmaPro 100 ALE with the Etchpoint UV reflectance etch depth monitor developed with LayTec. It measures remaining AlGaN thickness during processing, so p-GaN HEMT and recessed gate MISHEMT structures can be etched to a set depth.