DSC300 Gen3 Projection Scanner
Brand: SUSS MicroTec | Category: Nanotechnology
An automated projection lithography scanner for advanced packaging on 300 mm and 200 mm wafers. Wynne-Dyson optics print 2 µm lines and spaces with a large depth of focus, and the stitchless full field scan removes step field size limits on the layout.
Technical Specifications
| Parameter | Value |
|---|---|
| Wafer sizes | 300 mm, with 200 mm optional |
| Resolution | 2/2 µm lines and spaces |
| Overlay accuracy | 1.0 µm or better |
| Substrates | silicon, glass and silicon carbide |
| Warpage handling | up to 2 mm bow |
| Die shift compensation | ±200 ppm |
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Contact Vvon Technologies Limited about SUSS MicroTec equipment requirements in Bangladesh.
Phone: +8801805987890 | Email: info@vvon.com.bd
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