Brand: Oxford Instruments | Category: Nanotechnology

Ionfab systems perform ion beam etching, milling and ion beam deposition in a single chamber, with beam energy and ion flux controlled independently. Platen tilt sets the sidewall profile, and handling options run from open load to cassette to cassette.
| Parameter | Value |
|---|---|
| Wafer size | 100 mm or 200 mm |
| Etch RF ion source | 15 cm or 30 cm |
| Substrate rotation speed | up to 20 RPM standard, 500 RPM optional |
| Substrate tilt angle | -90° horizontal to +65° facing down |
| Platen temperature | 10 °C to 300 °C, chiller or heater configuration |
| Deposition ion source | 15 cm, 13.56 MHz driven, up to four targets with shutter |
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Contact Vvon Technologies Limited about Oxford Instruments equipment requirements in Bangladesh.
Phone: +8801805987890 | Email: info@vvon.com.bd
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