MA300 Gen3 Mask Aligner
Brand: SUSS MicroTec | Category: Nanotechnology
An automated mask aligner for 200 mm and 300 mm wafers in advanced packaging. It patterns through silicon vias, redistribution layers and bumping levels by proximity lithography, and copes with thick resist films that fall outside stepper capability.
Technical Specifications
| Parameter | Value |
|---|---|
| Wafer sizes | 200 mm and 300 mm |
| Alignment accuracy | 0.5 µm top-side with DirectAlign |
| Alignment options | top-side, bottom-side and infrared |
| Exposure | proximity lithography with MO Exposure Optics |
| Alignment software | DirectAlign with PatMax structure detection |
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Contact Vvon Technologies Limited about SUSS MicroTec equipment requirements in Bangladesh.
Phone: +8801805987890 | Email: info@vvon.com.bd
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